Compact, constant-temperature heating tool designed for mobile phone motherboard repair and micro-soldering
• Temperature Range: Adjustable from 20°C to 260°C for precise thermal control.
• Design: Features an aluminum alloy heating panel that delivers uniform heat without requiring a bulky hot air gun or soldering iron
• Motherboard Rework: Ideal for delamination, lamination, and layering of dual-board phones (such as iPhone X through recent models).
• Component Repair: Used for IC reballing (tin planting), glue removal (degumming), bonding, and dot matrix face ID repair.
• Safety: Minimizes thermal damage to surrounding components by providing centralized, uniform surface heat