Lagos, Lagos Island (Eko), 2 awanni da suka gabata
187 adadin kallo
2" Electric Dicing Machine
+1
2
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Jiha Lagos • Apapa
16, AGARAWU STREET, LAGOS ISLAND, LAGOS
Closed
• Lit - Asa, 08:00-18:00
Dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing with a dicing saw or by laser cutting. All methods are typically automated to ensure precision and accuracy.